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| Datasheet File OCR Text: |
| headquarters riverside ca www.bourns.com page 1 of 1 casrn: cas registry number is a registered trademark of the american chemical society material declaration sheet no. construction element(subpart) homogeneous material material weight [g] homogeneous material\ substances casrn if applicable materials mass % material mass % of total unit wt. subpart mass of total wt. (%) 1 die silicon chip 0.052 doped silicon 7440-21-3 100 1.707 1.707 base metal copper 744-50-8 96.75 39.39 base metal iron 7439-89-6 2.33 0.95 base metal phosphorus 7723-14-0 0.073 0.03 base metal zinc 7440-66-6 0.098 0.04 plating nickel 7440-02-0 0.663 0.27 plating palladium 744-05-3 0.039 0.0160 plating gold 7440-57-5 0.0095 .0039 2 lead frame impurity 1.24 lead 7439-92-1 0.03 0.0124 40.709 3 bond wire gold metal 0.02 gold 7440-57-5 68.59 0.45 0.656 others others - 39.61 0.78 4 die attach adhesive conductive material 0.06 silver 7440-22-4 59.97 1.181 1.969 filler epoxy resin 68928-70-1 5.47 3.02 filler phenol resin 29690-82-2 3.44 1.9 hardener silica 60676-86-0 80.169 44.189 filler carbon black 1333-86-4 0.238 0.131 5 mold compound filler 1.68 others - 10.468 5.77 55.12 total weight 3.046 this document was updated on: 18-march 2009 important remarks: 1. it is the responsibility of the user to verify they are accessing the latest version. material number cddfn10 series product line diode products compliance date 1 july 2008 rohs compliant yes msl 1
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